IRE-320L, IRE-320VL, IRE-640L - Cooled LWIR Cameras

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IRV Cooled Long Wavelength IR Thermal Imager

The Sofradir EC infrared camera family harnesses the full performance of the Sofradir Mars and Scorpio Mercury Cadmium Telluride (MCT) focal plane arrays while offering unique flexibility to meet the needs of any application or OEM requirement. The cameras are available in mid-format (320?~256) and largeformat (640?~512). The mid-format Mars-based cameras have broad spectral response capabilities ranging from broadband MWIR (1.5-5 ??m), MWIR (3-5 ??m), LWIR (8-10 ??m), and VLWIR (8-12 ??m). The Scorpio MW and LW based cameras operate in the MWIR (3-5 ??m) and LWIR (8-10 ??m) regions. The engines have a common connectivity and interface logic. The Mars and Scorpio camera engines include an integrated detector/dewar/cooler assembly (IDDCA) and electronics.

The camera electronics include camera and cooler control modules. The camera produces output signals that are uncorrected or corrected for non-uniformities in an RS-170 video and 14-bit digital data format. Camera communication is available over a serial (RS-232) interface. A 14-bit digital data stream is available via LVDS and Camera Link as well as optionally Gigabit Ethernet. With the optics options, the cameras can be customized to meet any requirement. D*STAR, a digital storage, retrieval and image processing Software Suite is available for infrared imaging research and development applications. In addition, software developer toolkits (SDKs) and command software modules are available for further flexibility.


  • High performance 320?256 imaging in MWIR/LWIR/VLWIR with the 30μm Mars MCT array
  • High performance 640?512 MWIR and LWIR imaging with the 15μm Scorpio MCT array
  • High frame rates for full frames (320 Hz for 320?256; 120 Hz for 640?512)
  • On-board non-uniformity correction and bad pixel replacement
  • Multiple cooler configurations (both linear and rotary options)
  • 14-bit digital output via LVDS and Camera Link, Gigabit Ethernet optional
  • Plug and play OEM operation
  • Multiple SDKs